Our extensive line of compact, rugged SBCs is based on CPUs targeting embedded applications, ranging from the economical AMD LX800 and Vortex86DX to the high performance Intel Core i7 latest generation U series Skylake/Kaby Lake. These products adhere to industry-standard form factors such as PC/104, COM Express, ETX, EPIC, and EBX.
Our SBCs are designed with 2 key criteria in mind: ruggedness and I/O. On average a DSC SBC will provide more I/O and greater ability to withstand harsh environments than other SBCs of the same size, CPU class, and price category.
2-in-1 SBCs
Most of our SBCs are 2-in-1 products. These boards incorporate a complete professional-quality data acquisition subsystem onto the board. By eliminating an add-on board required with other SBCs, this integration significantly reduces the size and weight of a system requiring analog I/O and can also to provide significant cost savings. Diamond pioneered this concept and still leads the industry in its implementation.
Conduction Cooled SBC
Most of our newer SBCs utilize superior conduction cooling for thermal management. Instead of the traditional heat sink which inefficiently transmits heat to low-mass air trapped inside the box, a conduction-cooled SBC utilizes a flat plate with a large surface area to transmit the heat directly to the much higher mass enclosure wall. Conduction cooling significantly reduces the temperature gradient between the CPU die and the exterior environment, leading to higher safety margins and higher reliability in high ambient temperature conditions. Diamond was an early adopter of conduction cooling in small form factor SBCs and today offers the widest range of these products.
ZETA |
VENUS |
ARIES |
HELIX |
HELIOS |
RHODEUS |
EAGLE |
EAGLET |
|
SBC FEATURES |
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Form Factor |
COM Express Mini |
3.5 inch |
PC/104-Plus |
PC/104 |
PC/104 |
PC/104 |
3.5 inch |
Small Form Factor |
Processor |
Bay Trail:E3825 1.33GHz 2CE3845 1.91GHz 4CApollo Lake:E3940 1.6GHz 4CN4200 1.1GHz 4C |
Skylake Gen6 Corei7-6600U 2.6GHz 2CKaby Lake Gen7Core i7-7600U2.8GHz 2C |
Bay Trail E38451.91GHz 4CBay Trail E38261.46GHz 2C |
Vortex86DX31GHz |
Vortex86DX1GHz/800MHz |
AMD Geode LX800500MHz |
Toradex Apalis ARM modules:
|
|
RAM |
E38xx 2GB downE3940 4GB downN4200 8GB down |
4GB down + 4-16GB DDR4 SODIMM |
E3826 2GB downE3845 4GB down |
1-2GB down |
256MB down |
512MB/1024MB SODIMM |
1-4GB down depeding on COM |
1-4GB down depending on COM |
Expansion Interface |
PCIe + SATA expansion connector |
PCI-104 ExpressPCIe + PCI2x PCIe MiniCard |
PC/104-PlusISA & PCIPCIe MiniCard |
PC/104 ISA |
PC/104 ISA |
PC/104 ISA |
PCIe MiniCardMicroModule |
PCIe MiniCardMicroModule |
DisplaySupport |
LVDS single channelVGA |
LVDS dual channelHDMIVGA |
LVDS dual channelHDMI, VGADisplayPort |
LVDS single channelVGA |
LVDS single channelVGA |
LVDS single channelVGA |
LVDSHDMIVGA (i.MX6 only) |
LVDSHDMIVGA (i.MX6 only) |
USB Ports |
4x USB 2.01x USB 3.0 |
2x USB2.04x USB3.0/USB2.0 |
3x USB 2.01x USB 3.0 |
3x or 6x USB 2.0 |
4x USB 2.0 |
2x USB 2.0 |
5-6x USB 2.02x USB 3.0OTG support |
2x USB 2.02x USB 3.0OTG support |
Serial Ports |
4x RS-232/422/485 |
4x RS-232/422/485 |
4x RS-232/422/485 |
2x RS-232 +2x RS-232/422/485 |
2x RS-232 +2x RS-232/422/485 |
1x RS-232 +1x RS-232/422/485 |
8x RS-232/422/485Software config |
2x RS-232 +2x RS-232/422/485 |
Network |
2x Gigabit Ethernet |
2x Gigabit Ethernet |
2x Gigabit Ethernet 1x |
10/100 Ethernet1x Gigabit Ethernet |
1x 10/100 Ethernet |
1x 10/100 Ethernet |
2x Gigabit Ethernet |
1x Gigabit Ethernet |
Mass Storage |
1x mSATA1x Micro SD |
1x SATA1x SATA-DOM1x mSATA |
1x SATA-DOM1x mSATA |
1 SATAmSATA flashdisk |
1 IDE flashdisk 1 |
IDE UDMA 33CompactFlash |
1 micro SD1 mSATA socket |
1 micro SD1 mSATA socket |
Kbd/Mouse |
USB |
USB |
USB |
PS/2 |
PS/2 |
PS/2 |
USB |
USB |
Audio |
HD Audio via Daughterboard |
HDA audio with Line in, Line out, Mic in |
HDA audio with Line in, Line out, Mic in |
HDA audio with Line in, Line out, Mic in |
– |
Speaker Out |
Line in, Line out, and Mic in |
Line in, Line out, and Mic in |
Power In |
6-36VDC |
9-18VDC |
5VDC |
5VDC |
5VDC |
5VDC |
9-36VDC |
5VDC |
OperatingTemp |
-40°C to +85°C |
-40°C to +85°C |
-40°C to +85°C |
-40°C to +85°C |
-40°C to +85°C |
-20°C to +71°C-40°C to +85°C |
-20°C to +71°C-40°C to +85°C |
-20°C to +71°C-40°C to +85°C |
Dimensions |
2.16″ x 3.30“55 x 84mm |
5.75″ x 4.0“146 x 102mm |
4.5″ x 4.0“114mm x 102mm |
3.550″ x 3.775″90mm x 96mm |
3.550″ x 3.775″90mm x 96mm |
3.550″ x 3.775″90mm x 96mm |
5.75″ x 4.0“146 x 102mm |
4″ x 4“102 x 102mm |
Weight |
7.7 oz (220g) |
12.4 oz (352g) |
10.4oz (296g) |
2.5oz (71g) |
2.5oz (71g) |
2.5oz (71g) |
4.2oz (119g) |
3.2oz (91g) |
DATA ACQUISITION FEATURES |
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Analog In |
16 single-ended/ 8 differential 16-bit resolution |
16 single-ended/ 8 differential 16-bit resolution |
16 single-ended/ 8 differential 16-bit resolution |
16 single-ended/ 8 differential 16-bit resolution |
4x single-ended 12-bit resolution |
4x single-ended 12-bit resolution |
||
Max Rate |
100KHz |
250KHz |
100KHz |
250KHz |
180KHz |
180KHz |
||
InputRanges |
10V, ±5V,0-10V, 0-5V |
± 10V, ±5V, ±2.5V,± 1.25V, 0-10V, 0-5V,0-2.5V |
± 10V, ±5V,0-10V, 0-5V |
± 10V, ±5V, ±2.5V,± 1.25V, 0-10V, 0-5V,0-2.5V |
0-3.3V |
0-3.3V |
||
Accuracy |
< ±28LSB |
< ±2LSB afterautocalibration < |
±28LSB |
< ±2LSB after autocalibration |
< ±18LSB |
< ±18LSB |
||
A/D FIFO |
2048 samples with programmable threshold |
2048 samples with programmable threshold |
2048 samples with programmable threshold |
2048 samples with programmable threshold |
||||
Analog Out |
4 16-bit |
4 16-bit |
4 16-bit |
4 12-bit |
||||
OutputRanges |
0-5V, 0-2.5V |
±5V, ±10V,0-5V, 0-10V |
0-5V, 0-2.5V |
±5V, ±10V,0-5V, 0-10V |
||||
Digital I/O |
27 GPIO 3.3V/5V |
16 GPIO 3.3V/5V |
22 GPIO 3.3V/5V |
16x GPIO (3.3V) |
19-27 GPIO 3.3V/5V |
16-40 GPIO 3.3V |
8x GPIO (3.3V) |
|
Direction |
Programmable |
Programmable |
Programmable |
Programmable |
Programmable |
Programmable |
Programmable |
|
Pull-up |
Prog. up/down |
Prog. up/down |
Prog. up/down |
Prog. up/down |
Prog. up/down |
Prog. up/down |
||
Opto I/O |
4 in, 4 out |
|||||||
Counters |
8 32-bit up/down |
8 32-bit up/down |
8 32-bit up/down |
1 24-bit, 1 16-bit |
Produtos
Zeta (Miniature COM-Based SBC)
The Zeta COM Express SBC family of ultra-small embedded computer boards combines a COM Express Mini CPU module with a same-size carrier board to create a complete embedded PC. Designed in the COM Express Mini Type 10 form factor (84x55mm / 3.3×2.2 in), Zeta provides an ultra-compact, industry-standard form factor solution.
Venus (3.5 Inch Core i7/i5 SBC)
Based on the “Skylake” or “Kaby Lake” 6th and 7th generation processors, Venus offers the highest available CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
Aries (PC/104-Plus SBC)
The Aries PC/104-Plus single board computer from Diamond Systems uses the Intel “Bay Trail” E3800 series processor to deliver an unmatched combination of performance, price and power consumption. Packed with real-world features, Aries provides a complete solution for most embedded applications in a single board, saving you space, time, and money.
Aries goes beyond the standard processor and I/O features found on other Bay Trail SBCs to provide rugged performance along with a professional-quality data acquisition circuit supported by industry-leading software. The full rectangular shape of Aries provides more PCB area and coastline to support the extreme level of I/O offered by the board.
Helix (PC/104 SBC)
Diamond’s family of Helix PC/104 SBCs combines mid-range CPU performance, standard PC I/O, and on-board data acquisition circuitry at a competitive price. Available PC I/O includes 3 or 6 USB 2.0 (model dependent), 4 serial ports (2 RS-232/422/485 and 2 RS-232), 1 10/100Mbps Ethernet, 1 Gigabit Ethernet port, and a SATA port. The data acquisition circuit includes 16 16-bit analog inputs, 4 16-bit analog outputs and 27 digital I/O lines configurable as counter/timers and pulse width modulators.
Helix supports stackable I/O expansion with PC/104 I/O modules and provides a PCIe MiniCard socket for additional I/O expansion. I/O modules featuring WiFi, Ethernet, analog I/O, digital I/O, and CAN are available in the PCIe MiniCard form factor, providing compact expandability without increasing the total height of the system.
Helix SBCs run Linux and Windows Embedded Standard 7. Both Linux and Windows Embedded 7 Software Development Kits are available with bootable images and drivers to get you started on your design project right out of the box. Note: Board does not support booting from mSATA port.
The Helix SBC was designed with rugged applications in mind. With an operating temperature of -40°C to +85°C, soldered on-board memory, and thicker PCB, Helix is an excellent choice for vehicle and other harsh environment applications.
Helios (PC/104 SBC)
Helios is a low power, mid-range performance PC/104 form factor single board computer combining a highly integrated CPU with Diamond Systems’ renowned high-accuracy data acquisition circuitry on a single board, reducing size and cost while increasing ruggedness. Helios utilizes a Vortex integrated single chip CPU operating at 800MHz or 1GHz, and 256MB of DRAM soldered on-board.
Helios incorporates advanced features such as four USB 2.0 ports, an IDE hard drive interface, mounting capability for a solid state flashdisk up to 4GB, and CRT/LVDS LCD graphics. Helios also provides a 10/100Base-T Ethernet interface, two RS-232 serial ports, two RS-232/422/485 serial ports and legacy keyboard and mouse interfaces.
Helios includes an on-board 2MB bootable flash drive with FreeDOS installed. This flash drive offers additional cost savings for DOS applications, since no additional storage medium is required. It also enables you to quickly verify Helios’s operation. Just connect keyboard, monitor, and power, and Helios boots up to DOS so you can verify proper working condition as well as test the various features on the single board computer.
Helios is extremely rugged, featuring on-board soldered DRAM and -40°C to +85°C fan-less operation. Optional hardwired jumpers and latching connectors are available for increased resistance to shock and vibration. Conformal coating is available as an extra cost option.
Rhodeus (PC/104 SBC)
Rhodeus is a fan-less PC/104 SBC which features the AMD Geode LX800 low power consumption processor running at 500MHz. It uses high speed DDR SDRAM providing maximum capacity at 1GB. Rhodeus offers fully integrated PC functionality with low power consumption which allows Rhodeus to operate in harsh environments where the airflow for heat dissipation is restricted and heat sinks or fans are unacceptable. Its ruggedability gives it the power to perform round-the-clock in unattended environments.
Other advantages of Rhodeus includes high speed 10/100 Ethernet LAN and ample I/O interfaces, 2 serial ports, 2 USB 2.0 ports, parallel port for peripheral connection, 1 ATA-33 channel, Compact Flash Type-II socket, PC/104 expansion bus, LCD & CRT interface, floppy, and watchdog timer. Rhodeus has all the necessary features and expansion capability in 96 X 90 mm form factor, which makes it ideal for applications where space is limited but multiple I/O configurations are needed. Rhodeus supports Windows 2000, Windows XP, Windows CE 5.0, and Linux.
Eagle (ARM SBC)
The Eagle SBC combines the Toradex Apalis family of ARM COMs with a wide variety of standard and industrial I/O features to create off-the-shelf solutions for ARM-based industrial embedded computing. Eagle SBCs include the selected ARM module and heat sink pre-installed on the Eagle baseboard. Eagle SBCs include the selected ARM module and heat sink pre-installed on the Eagle baseboard.
Eagle provides a long life, scalable platform for ARM-based application development. Toradex’s Apalis module family currently contains three members, with the newest module, Apalis TK1, recently introduced in July 2016. The Apalis form factor, as well as all processors used on the modules, have long life commitments from their suppliers, ensuring long life availability of the complete product. Customers have great flexibility in selecting not only the price/performance characteristics of the installed COM, but multiple configurations including the number of cores, memory and flash size, and operating temperature range.
Most I/O features can be configured to meet any customer’s specific requirements as well as cost and power consumption targets. This includes removal of unneeded features and I/O connectors plus additional ruggedization services.
Eaglet (ARM SBC)
The Eaglet SBC combines the Toradex Apalis family of ARM COMs with a wide variety of standard and industrial I/O features to create off-the-shelf solutions for ARM-based industrial embedded computing. Eaglet SBCs include the selected ARM module and heat sink pre-installed on the Eagle baseboard. Eaglet SBCs include the selected ARM module and heat sink pre-installed on the Eaglet baseboard.
Eaglet provides a long life, scalable platform for ARM-based application development. Toradex’s Apalis module family currently contains three members, with the newest module, Apalis TK1, recently introduced in July 2016. The Apalis form factor, as well as all processors used on the modules, have long life commitments from their suppliers, ensuring long life availability of the complete product. Customers have great flexibility in selecting not only the price/performance characteristics of the installed COM, but multiple configurations including the number of cores, memory and flash size, and operating temperature range.
Most I/O features can be configured to meet any customer’s specific requirements as well as cost and power consumption targets. This includes removal of unneeded features and I/O connectors plus additional ruggedization services.
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