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VPX Backplanes


VPX presents many design challenges and experienced teams like Elma Bustronic’s are best suited to take them on. With 480 pins per slot with up to 186 differential pairs, there is an incredible amount of I/O to route through the backplane. Additionally, VPX uses high-speed differential serial signals that can switch well in excess of 3.0 GHz. The VITA 46 spec acknowledges that the backplane may require up to 16 routing layers, and a huge 36- layer overall PCB stackup. The result could be long via stubs which can degrade the signal. To alleviate this, Elma Bustronic performs simulations to optimize the signal quality of the design and minimize the negative stub effects. One key method is to take the performance requirements, which typically would be 3.125 GBps or 6.250 GBps and route the backplane to minimize the layer count, but follow proper design rules. Design rules typically specify how close signals should be to another or to components, avoiding 90 degree bends of the signal, and so on. Reducing the layer count can shorten the stubs, thus reducing the stub effect. In most cases, a high-grade laminate will need to be used even in smaller (fewer slot) backplanes. For example, the five-slot VPX backplane uses an FR-408 low-dielectric material to enhance performance.

3U VPX Backplane

VPX uses the high-speed multi-gig connector in a mesh topology, vastly increasing the potential bandwidth of the system. While maintaining backward compatibility with legacy VME technology via preservation of the VMEbus 3U mechanical form factor and through-mapping of the current VMEbus signals to the VITA 46 connectors.

6U VPX Backplane

VPX uses the high-speed multi-gig connector in a mesh topology, vastly increasing the potential bandwidth of the system. While maintaining backward compatibility with legacy VME technology via preservation of the VMEbus 6U mechanical form factor and through-mapping of the current VMEbus signals to the VITA 46 connectors.

VPX Chassis

The VPX Tower offers a carrying handle for easy portability making it ideal for prototyping, demonstrations, and for mobile applications. The unit also features advanced EMC shielding, scratch-resistant vinyl clad aluminum covers, and power components.


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