Innodisk, the service-driven
flash and DRAM provider, announces higher capacity 16GB versions
of its DDR4 embedded and server unbuffered DRAM series. These 2133MHz
UDIMMs and SODIMMS now come in industry-leading 16GB capacities,
allowing more memory to be installed within space constrained embedded
systems, industrial PCs and servers. Offering higher performance
with lower power consumption compared to DDR3, the new DRAM modules
have ECC available for reliability, as well as industrial strength
features from Innodisk such as 30u” Gold Finger connectors,
thermal sensors, and protective conformal coatings. The new 16GB
modules make Innodisk’s range of DDR4 products the most complete
line of embedded and server DDR4 memory on the market.
"16GB is the highest capacity unbuffered DDR4 module
available on the market,” said Samson Chang, Vice President
of Embedded DRAM Business Unit of Innodisk. “We’re
proud that Innodisk is able to provide this memory capacity while
bringing the performance
and low power benefits of DDR4 to the embedded and server markets.
In addition, we’re bringing extra value to our industrial
customers with Innodisk features like onboard thermal sensors and
Improved Memory Performance at Lower Voltage
With up to 30% better performance with 20% lower power consumption
compared DDR3 memory, Innodisk’s unbuffered DDR4 modules and
are a natural fit for the embedded industry. At 1.2V they
use even less power than the 1.35V DDR3L Low Voltage standard. With the
advent of the Intel Skylake platform, Innodisk's 16GB DDR4 UDIMMs
and SO-DIMMs will unlock higher performance for memory-constrained
embedded and server applications.
Reliable Industrial Strength Technology
With enhanced error detection and handling capabilities including
parity error detection and Cyclic Redundancy Check (CRC), DDR4 improves
memory reliability. In addition, Innodisk’s 16GB DDR4 modules
are infused with its industrial know-how, including robust connectors,
thermal sensors, and conformal coatings. An extra proprietary 30u
Golden Finger connector is 10 times thicker than the JEDEC standard,
creating an extra-reliable interface. Thermal sensors on the module
alert the system to temperatures changes, preventing overheating.
Protective conformal coatings are available to guard agaist a variety
of physical and chemical contaminants.
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